ceramic substrate （意思翻译）

陶瓷；陶瓷基片；[电子]陶瓷衬底

ceramic substrate （相似词语短语）

1、aluminia ceramic───铝陶瓷

2、coir substrate───椰壳衬底

3、enamels ceramic───搪瓷

4、ceramic───n.陶瓷；陶瓷制品；adj.陶瓷的；陶器的；制陶艺术的

5、ceramic bowl───陶瓷碗

6、zirconia ceramic───氧化锆陶瓷

7、ceramic hob───电陶炉

8、ceramic cookware───陶瓷炊具

9、sapphire substrate───[电子]蓝宝石衬底

ceramic substrate （双语使用场景）

1、Silver thick film conductor was fabricated directly on ceramic substrate by micro-atomization(Microjet) spraying deposition.───采用微细雾化PenShe沉积直写的方法在陶瓷基板上制备银厚膜导体。

2、Ti is an active metal and expected to react with YSZ and aid in wetting the ceramic substrate to help in the bonding.───钛是一种活性金属和预期作出反应的氧化锆和援助在润湿的陶瓷基板，以帮助在粘接。

3、Cadmium contained in the cadmium oxide of a thick film ceramic substrate .───厚膜陶瓷基质的氧化镉中所含的镉。

4、If you have no experience with ceramic substrate , we will likely not be to work with you on this project.───如果你没有与陶瓷基板的经验，我们可能会无法与您携手，在这个项目上。

5、a circuit formed by two faces of copper foils of the ceramic substrate are interconnected and guided through a sintered via hole.───陶瓷基板两面铜箔构成的线路通过烧结而成的过孔进行互联导通。

6、The chip component comprises a ceramic substrate and at least one radiating element.───芯片元件包括陶瓷衬底和至少一个辐射元件。

7、Thick film conductor was prepared on ceramic substrate by laser micro-cladding.───采用激光微细熔覆直写布线的方法在陶瓷基板上制备高密度厚膜导体。

8、The invention aims to truly eliminate flaws surrounding an internal conductor in a multilayer ceramic substrate with the internal conductor.───本发明的目的是，在具有内部导体的多层陶瓷衬底中确实消除内部导体周围产生的缺陷。

ceramic substrate （英语使用场景）

1、The chip component comprises a ceramic substrate and at least one radiating element.

2、The sensor chip is flip-chip packaged on a thin ceramic substrate using copper pillar bump technology.

3、The mechanism of scribing ceramic substrate by using RF CO2 laser is analyzed. The design of the scribing system is presented.

4、The characteristic of RF CO2 laser and its ceramic substrate scribing are presented.

5、Silver thick film conductor was fabricated directly on ceramic substrate by micro - atomization ( Microjet ) spraying deposition.

6、Also, DSC is employed to obtain the thermal deformation field of the assembly structures of flip chip on ceramic substrate , especially for the strain concentrating area around the solder joints.

7、The technology of AlN ceramic substrate volume production is introduced in this paper.

8、A novel technique of laser micro-cladding is used to flexibly and directly fabricate thick-film resistors on ceramic substrate .